i-Bot Technology provides EFEM, sorter, packing / unpacking and wafer transfer standard equipment for semiconductor customers, and has sufficient development ability and experience to customize equipment and develop new equipment. It also provides EFEM related key components such as robot; Pre-aligner ; Loadport ; OCR ; RFID reader …More
We design, develop and manufacture the Probe Measurement(RS & Leakage) ,Automated Optical Inspection, Metal Film Thickness Measuring(4PP), and other related measurement equipment, and continuously improve products to meet customers' needs of their rapidly changing process technology.
i-Bot Technology provides frame sorter, Auto Bar Code Sticker, Dispensing system, Chip Counter and other equipment to semiconductor rear packaging test customers.More
We provide RFID reader related to Industry 4.0; Real-time data collection and analysis of semiconductor equipment or Robot can effectively predict the repair time of equipment or manipulator in advance.More
i-Bot Technology sales agent CyberOptics 3D measurement equipment; NBS automatic wafer packaging transfer machine; Trymax Plasma Descum _ PR stripper systemMore
i-Bot Technology focuses on the renovation and maintenance of wafer transfer robot / Pre-aligner / controller, mainly serving in semiconductor wafer factories and electronic manufacturers.More
i-Bot Technology was established in 2006 , a professional company with advanced expertise and technologies, we focus on full refurbishment and repair of existing robotic systems, pre-aligners and controllers as used in the semiconductor industries. Our main focus for such robotic systems include GenMark ; Yaskawa and PRI(Equipe) . Since 2010 we also provided Semiconductor Automation Equipment systems designed and manufactured as fully Auto Rs/Leakage measurement system ; fully auto metal film measurement system(4 point prober) ; fully auto CD/Edge/Overlay measurement system ; fully auto Raman Analyzer ; wafer sorter ; EFEM ; fully auto AOI inspection/measurement system ; fully auto 2D/3D measurement system ; Thin wafer handler / packing systems ; Plasma Descum tool and other customized semiconductor equipment .