全自動晶圓刻號偏移量測暨上下對位量檢測

全自動晶圓刻號偏移量測暨上下對位量檢測

Features


*Wafer Size:8” -12”
*Dual CCD Function (Bottom & Top)
   - Automatic Focus system
   - Automatic dimming system
   - Wafer Map Auto creation "
*3D Function: Wafer marking depth measurement (1~50um, resolution 0.1um)
*2D Function: Laser Marking Shift & width measurement(10~100um, resolution 1um)
*Support OHT/AGV/SECS GEM200 OR GEM300
*Support Ultra-Thin & high warpage wafer
*ESD protection
*Wafer Top & Bottom marking shift measure after laser making
*Scribe Line &marking measure

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