WPC 200 Advance

NBS 全自動晶圓包裝機

Features


*Auto Packing, Unpacking, Sorting
*Semi Carriers : Open Carriers / Horizontal Finished Wafer Shipper
*200/150 mm capability
*Wafer thickness down to 180 µm (200 mm)
*Modular configuration
*SEMI, CE Compliant
*SECSII Communication

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